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* Split *_product makefilesSzuWei Lin2019-01-161-0/+2
| | | | | | | | | | | | | | | | So far, we have *_system.mk and *_vendor.mk. This patch split all product settings from *_vendor.mk to new *_product.mk This patch also create a new telephony.mk to include all telephony_*.mk Bug: 119747870 Test: lunch mainline_arm64-user; make -j Test: compare the content with and without the patch Test: the output files in out folder are the same Change-Id: I79aefdd1971b3b5724a3ec858de4109b645c765a Merged-In: I79aefdd1971b3b5724a3ec858de4109b645c765a
* Add mainline.mkAnton Hansson2019-01-071-0/+21
Contains mainline_system and the relevant AOSP packages for the other partitions. Intended to be inherited by the aosp_X variants of mainline devices. Bug: 118826166 Test: build mainline_arm64 Change-Id: I7d1953bf5ccda4d9652dca4d32efb75b31015342