This EDMA3 Low Level Driver Release is targeted to the users (device drivers and applications) for submitting and synchronizing with EDMA3 based DMA transfers. This release supports DA830,C6748,TCI6498,TI816X,C6472,TCI6486,TI814X,TI816X,TI811X,TCI6608,TCI6616,TCI6614,C6670,C6678,TCI6638K2K,TDA2xx platforms, on SYS/BIOS 6 side & OMAPL138 on SYS/BIOS and ARM side. Porting instructions are also provided to use the package for different platforms and Operating Systems.
Introduction, Documentation, What's New, Upgrade Info, Device Support, Compatibility Information, Validation Info, Known Issues, Examples, Version Information, Technical Support
EDMA3 LLD is a single product package containing the following stand-alone software components:
EDMA3 Resource Manager can be used independently whereas the EDMA3 Driver requires the Resource Manager services internally.
EDMA3 LLD (both Resource Manager and the Driver) is a platform independent package. Hence it can be used across multiple platforms. Porting instructions are provided for both the components to do the same.
It is also an OS-agnostic package and thus can be used across multiple operating systems. OS-adaptation layer needs to be provided by the user (in case it is needed) for OS customization. Instructions to do the same are also provided along with the package.
The Low Level Driver has already been ported (SYS/BIOS Operating Systems) and tested on various platforms mentioned below. Sample initialization libraries, which configure the EDMA3 hardware and provide the necessary OS abstraction layer, are also a part of the package. These libraries are available both for the EDMA3 Resource Manager and EDMA3 Driver. These could be used for proper initialization of the software component(s) along with the OS adaptation layer for the same.
The Low Level Driver consists of the following packages:
The following documentation is available:
The following significant changes have been made since 02.11.07:
02.11.08 - This release
The following IRs are implemented:
|SDOCM00101975||EDMA3 LLD compatibility key causing unnecessary build failure|
|SDOCM00102051||Determining the core by reading from a core id or device id register (if possible), instead of compile time definitions.|
The following IRs are raised on this release:Known Issues
|SDOCM00078640||ARM 9 support for OMAPL138 is not available on Make based build of EDMA3LLD|
|SDSCM00039169||EDMA3 Example fails for following Big Endian Simulators targets tci6608-sim/tci6616-sim|
The EDMA3 LLD packages are available in the "packages/" subdirectory of the product. If you have a previous release of the EDMA3 LLD product, you can install this release next to it, and modify your application and/or server builds to use this newer release.
This release supports and has been tested on the following devices:
Compatibility keys are intentionally independent of Marketing product numbers and are intended to:
Compatibility keys are composed of 3 comma-delimited numbers - M, S, R - where:
This release was built and validated against using the following components:
This release was validated in the following configurations:
The following are known issues with the current EDMA3 LLD release:
Pre-built instrumented EDMA3 libraries for DA830 will not be provided initially. XDC does not support the same and hence the limitation. See IR# SDOCM00036738 for more details.
Very few peripherals support EDMA3 FIFO mode. EMIF controller doesn't support the same. So EDMA3 CANNOT be used in FIFO mode for doing a memory-to-memory data transfers, EDMA3 being configured in the FIFO mode. Applications trying to use EDMA3 in FIFO mode should first check their respective peripheral-controller document for this mode support.
The PingPong example in the package fails for certain EDMA Instances for some DSP cores in Release mode only. It passes for Debug mode. See IR# SDOCM00064758 for more details.
EDMA3 LLD sample initialization libraries / OS abstraction layers (for different platforms) are located in:
EDMA3 LLD stand-alone applications (for different platforms) are located in:
This product's version follows a version format, M.mm.pp.bb, where M is a 2 digit major number, mm is 2 digit minor number, pp is a 2 digit patch number, and b is an unrestricted set of digits used as an incrementing build counter.
To support multiple side-by-side installations of the product, the product version is encoded in the top level directory, ex. edma3_lld_02_11_08_XX.
Subsequent releases of patch upgrades will be identified by the patch number, ex. EDMA3 LLD 02.11.08 with directory edma3_lld_02_11_08_YY. Typically, these patches only include critical bug fixes.
For technical support, Please post at TI E2E forum http://e2e.ti.com/support/embedded/f/355.aspx
Last updated: July 3, 2013