Merge pull request #860 in PROCESSOR-SDK/pdk from don/makefile_common_comp to master
authorSivaraj R <sivaraj@ti.com>
Mon, 6 Jul 2020 10:43:14 +0000 (05:43 -0500)
committerSivaraj R <sivaraj@ti.com>
Mon, 6 Jul 2020 10:43:14 +0000 (05:43 -0500)
commit5dfc405c3378a3b09f2291cd2d7084f3d46dff0b
tree53057325391848228b63d3cb8b5eb746e2a12379
parent2ad2382de1efadcd8d92da943f521dc6893b1314
Merge pull request #860 in PROCESSOR-SDK/pdk from don/makefile_common_comp to master

Squashed commit of the following:

commit f08f91c0a362c69f750741096693b24590cf8f0c
Author: Don Dominic <a0486429@ti.com>
Date:   Mon Jul 6 09:52:24 2020 +0530

    Vuild Issue Fix 3 Test

Signed-off-by: Don Dominic <a0486429@ti.com>
commit 02d72c3aa5873483ab1f88d62f19febe9f44d7d6
Author: Don Dominic <a0486429@ti.com>
Date:   Fri Jul 3 17:54:24 2020 +0530

    Added udma and gpio

        Include 'gpio' for all soc's except AM64x and TDA platforms
        Include 'sciclient' and 'udma' for all K3 platforms

Signed-off-by: Don Dominic <a0486429@ti.com>
commit 48dc8afc52061a192c5ed77b57e53b586fbd1345
Author: Don Dominic <a0486429@ti.com>
Date:   Fri Jul 3 14:42:42 2020 +0530

    Build Issue Fix 2 Test

Signed-off-by: Don Dominic <a0486429@ti.com>
commit 71d2792205fcb3df1497e479b249de50f9480f96
Author: Don Dominic <a0486429@ti.com>
Date:   Fri Jul 3 12:31:14 2020 +0530

    Build Issue Fix Test

Signed-off-by: Don Dominic <a0486429@ti.com>
commit d63a5ab2415dc8aaff2844c925b52fcb73ffc85b
Author: Don Dominic <a0486429@ti.com>
Date:   Thu Jul 2 14:27:06 2020 +0530

    [PDK-6923] Makefile : Added new variables PDK_COMMON_TIRTOS_COMP and PDK_COMMON_BAREMETAL_COMP

    Includes all the mandatory dependency libraries - csl, board, i2c, uart
    Include 'osal_nonos' for baremetal applications
    Includes 'csl_intc' for baremetal c66x arch and 'csl_init' for all baremetal non c71 arch
    Include 'osal_tirtos' for RTOS applications
    Include 'sciclient' for all K3 platforms
    Include 'pmic lld' for J7 platforms

    -Updated all makefiles in pdk_repo to use this variables

Signed-off-by: Don Dominic <a0486429@ti.com>
141 files changed:
packages/ti/board/diag/adc/build/makefile
packages/ti/board/diag/automation_header/build/makefile
packages/ti/board/diag/boost_gpio/build/makefile
packages/ti/board/diag/boot_eeprom/build/makefile
packages/ti/board/diag/boot_switch/build/makefile
packages/ti/board/diag/button/build/makefile
packages/ti/board/diag/clock_generator/build/makefile
packages/ti/board/diag/cpsw/build/makefile
packages/ti/board/diag/csirx/build/makefile
packages/ti/board/diag/current_monitor/build/makefile
packages/ti/board/diag/display_port/build/makefile
packages/ti/board/diag/dsi/build/makefile
packages/ti/board/diag/eeprom/build/makefile
packages/ti/board/diag/emac/build/makefile
packages/ti/board/diag/emmc/build/makefile
packages/ti/board/diag/exp_header/build/makefile
packages/ti/board/diag/ext_rtc/build/makefile
packages/ti/board/diag/fpd_lib/build/makefile
packages/ti/board/diag/framework/build/makefile
packages/ti/board/diag/hdmi/build/makefile
packages/ti/board/diag/hyperbus/build/makefile
packages/ti/board/diag/icssg_led/build/makefile
packages/ti/board/diag/lcd/build/makefile
packages/ti/board/diag/led/build/makefile
packages/ti/board/diag/led_industrial/build/makefile
packages/ti/board/diag/leo_pmic_lib/build/makefile
packages/ti/board/diag/lin/build/makefile
packages/ti/board/diag/mcan/build/makefile
packages/ti/board/diag/mcasp/build/makefile
packages/ti/board/diag/mem/build/makefile
packages/ti/board/diag/mmcsd/build/makefile
packages/ti/board/diag/norflash/build/makefile
packages/ti/board/diag/ospi/build/makefile
packages/ti/board/diag/pcie/build/makefile
packages/ti/board/diag/pmic/build/makefile
packages/ti/board/diag/rotary_switch/build/makefile
packages/ti/board/diag/rs485_uart/build/makefile
packages/ti/board/diag/temperature/build/makefile
packages/ti/board/diag/uart/build/makefile
packages/ti/board/diag/usb_device/build/makefile
packages/ti/board/diag/usb_host/build/makefile
packages/ti/board/examples/ddr_thermal_test_app/makefile
packages/ti/board/utils/uniflash/target/build/uart_make.mk
packages/ti/boot/sbl/build/sbl_img.mk
packages/ti/boot/sbl/build/sbl_mcu0_boot_perf_test.mk
packages/ti/boot/sbl/build/sbl_smp_test.mk
packages/ti/build/makerules/component.mk
packages/ti/diag/examples/esm_example_app/makefile
packages/ti/diag/sdr/test/sdtf-test/makefile.mk
packages/ti/drv/cal/examples/cal_capture_test/makefile.mk
packages/ti/drv/cal/examples/cal_loopback_test/makefile.mk
packages/ti/drv/crc/test/makefile
packages/ti/drv/dss/examples/dss_colorbar_test/makefile
packages/ti/drv/dss/examples/dss_display_test/makefile.mk
packages/ti/drv/edma/examples/edma_memcpy_test/makefile
packages/ti/drv/emac/example/PacketInspection/dra7xx/makefile
packages/ti/drv/emac/test/EmacLoopbackTest/am65xx/cpsw/makefile
packages/ti/drv/emac/test/EmacLoopbackTest/am65xx/icssg/makefile_dualmac
packages/ti/drv/emac/test/EmacLoopbackTest/am65xx/icssg/makefile_without_ddr
packages/ti/drv/emac/test/EmacLoopbackTest/j721e/cpsw/makefile
packages/ti/drv/emac/test/EmacLoopbackTest/j721e/icssg/makefile
packages/ti/drv/emac/test/EmacLoopbackTest/j721e/icssg/makefile_dualmac
packages/ti/drv/gpio/test/led_blink/makefile
packages/ti/drv/hwa/test/makefile
packages/ti/drv/i2c/example/i2c_utility/makefile
packages/ti/drv/i2c/example/tdaxx/led_blink/makefile
packages/ti/drv/i2c/test/eeprom_read/makefile
packages/ti/drv/i2c/test/master_slave/makefile
packages/ti/drv/iolink/test/stack_test/makefile
packages/ti/drv/ipc/examples/common/makefile.mk
packages/ti/drv/ipc/examples/ipc_perf_test/makefile.mk
packages/ti/drv/mailbox/examples/mailbox_msg_testapp/makefile
packages/ti/drv/mailbox/examples/mailbox_perf_testapp/makefile
packages/ti/drv/mailbox/examples/mailbox_perf_testapp/makefile_baremetal
packages/ti/drv/mcasp/example/MCASP_AudioDCAnalogLoopback_TestApp/makefile
packages/ti/drv/mcasp/example/MCASP_AudioDCDigitalLoopback_TestApp/makefile
packages/ti/drv/mcasp/example/MCASP_AudioLoopback_TestApp/makefile
packages/ti/drv/mcasp/example/MCASP_DeviceLoopback_Regression_TestApp/makefile
packages/ti/drv/mcasp/example/MCASP_DeviceLoopback_TestApp/makefile
packages/ti/drv/mibspi/test/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_DMA_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_DMA_TestProject/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_EMMC_DMA_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_EMMC_DMA_TestProject/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_EMMC_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_EMMC_TestProject/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_Regression_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_Baremetal_TestProject/makefile
packages/ti/drv/mmcsd/test/MMCSD_DMA_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_DMA_TestProject/makefile
packages/ti/drv/mmcsd/test/MMCSD_EMMC_DMA_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_EMMC_DMA_TestProject/makefile
packages/ti/drv/mmcsd/test/MMCSD_EMMC_Regression_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_EMMC_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_EMMC_TestProject/makefile
packages/ti/drv/mmcsd/test/MMCSD_Regression_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_TestApp/makefile
packages/ti/drv/mmcsd/test/MMCSD_TestProject/makefile
packages/ti/drv/pcie/example/Qos/makefile
packages/ti/drv/pcie/example/sample/makefile
packages/ti/drv/pruss/example/apps/sorte/master/makefile
packages/ti/drv/pruss/example/apps/sorte/slave/makefile
packages/ti/drv/sciclient/examples/sciclient_ccs_init/makefile
packages/ti/drv/sciclient/examples/sciclient_firmware_boot_TestApp/makefile
packages/ti/drv/sciclient/examples/sciclient_fw_testapp/makefile
packages/ti/drv/sciclient/examples/sciclient_rtos_app/makefile
packages/ti/drv/sciclient/examples/sciclient_unit_testapp/makefile
packages/ti/drv/spi/example/mcspiLoopbackApp/makefile
packages/ti/drv/spi/example/mcspi_slavemode/makefile
packages/ti/drv/spi/test/ospi_flash/makefile
packages/ti/drv/spi/test/qspi_flash/makefile
packages/ti/drv/uart/example/UART_BasicExample_Intr_ExampleProject/makefile
packages/ti/drv/uart/example/UART_BasicExample_Polling_ExampleProject/makefile
packages/ti/drv/uart/test/makefile
packages/ti/drv/udma/dmautils/test/dmautils_autoinc_1d2d3d_test/makefile
packages/ti/drv/udma/dmautils/test/dmautils_autoinc_circular_test/makefile
packages/ti/drv/udma/dmautils/test/dmautils_autoincrement_test/makefile
packages/ti/drv/udma/examples/udma_adc_test/makefile
packages/ti/drv/udma/examples/udma_chaining_test/makefile
packages/ti/drv/udma/examples/udma_crc_test/makefile
packages/ti/drv/udma/examples/udma_dru_direct_tr_test/makefile
packages/ti/drv/udma/examples/udma_dru_test/makefile
packages/ti/drv/udma/examples/udma_memcpy_test/makefile.mk
packages/ti/drv/udma/unit_test/udma_ut/makefile
packages/ti/drv/usb/example/build/usb_dev_bulk/makefile
packages/ti/drv/usb/example/build/usb_dev_msc/makefile
packages/ti/drv/usb/example/build/usb_host_msc/makefile
packages/ti/drv/watchdog/test/makefile
packages/ti/fs/fatfs/example/console/makefile
packages/ti/osal/test/baremetal/makefile
packages/ti/osal/test/cpptest/makefile
packages/ti/osal/test/sysbios_unit_test/makefile
packages/ti/transport/ndk/nimu/example/am65xx/cpsw/makefile
packages/ti/transport/ndk/nimu/example/am65xx/icssg/makefile
packages/ti/transport/ndk/nimu/example/ftpApp/am65xx/cpsw/makefile
packages/ti/transport/ndk/nimu/example/ftpApp/am65xx/icssg/makefile
packages/ti/transport/ndk/nimu/example/ftpApp/j721e/cpsw/makefile
packages/ti/transport/ndk/nimu/example/ftpApp/j721e/icssg/makefile
packages/ti/transport/ndk/nimu/example/j721e/cpsw/makefile
packages/ti/transport/ndk/nimu/example/j721e/icssg/makefile