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author | Dan Murphy <dmurphy@ti.com> | |
Fri, 27 Mar 2020 12:23:50 +0000 (07:23 -0500) | ||
committer | Dan Murphy <dmurphy@ti.com> | |
Fri, 27 Mar 2020 12:24:51 +0000 (07:24 -0500) |
Fix the test suite names for the am3 and am4 build ethernet as module
test case.
Signed-off-by: Dan Murphy <dmurphy@ti.com>
test case.
Signed-off-by: Dan Murphy <dmurphy@ti.com>
system_test/system_test_recipe | patch | blob | history |
index bd117885ecb49110a638c734f161a03968b7969b..df629ea8f66f53f2273c919bd9faba8548ef8a78 100644 (file)
-arch: arm testsuite: am3_mmc_module output: am3_mmc defconfig: am3_eth_module overlay_dir: none
-arch: arm testsuite: am4_mmc_module output: am4_mmc defconfig: am4_eth_module overlay_dir: none
+arch: arm testsuite: am3_mmc output: am3_mmc defconfig: am3_eth_module overlay_dir: none
+arch: arm testsuite: am4_mmc output: am4_mmc defconfig: am4_eth_module overlay_dir: none
arch: arm testsuite: am3_usbhost output: am3_usbhost defconfig: am3_pio_musb overlay_dir: none
arch: arm64 testsuite: j7_usb_otg_full_speed output: j7_usb_otg_full_speed defconfig: ti_sdk_arm64_release dt_overlay: usb_otg/j7/full_speed
arch: arm64 testsuite: j7_usb_otg_high_speed output: j7_usb_otg_high_speed defconfig: ti_sdk_arm64_release dt_overlay: usb_otg/j7/high_speed